东芝光耦DIP4封装规矩SpecificaTIon of DIP4 package
| Toshiba Code | 11-5B2 | |
|---|---|---|
| MounTIng | Through Hole | |
| Pins | 4 | |
| Weight (typ.) | 0.26 g | |
| Packing Method | Magazine | |
| Minimum QuanTIty | 100 pcs/Magazine | |
| Package Dimensions (mm) |
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|
| MagazineDimensions (mm) |
 Thickness: 0.5 mm |
 A: Magazine, B: Stopper |
