选用DIP16(LF1)封装的光耦SpecificaTIon of DIP16(LF1) package
| Toshiba Code | 11-20A301 | |
|---|---|---|
| MounTIng | Surface Mount | |
| Pins | 16 | |
| Weight (typ.) | 1.1 g | |
| Packing Method | Magazine | |
| Minimum QuanTIty | 25 pcs/Magazine | |
|
Package Dimensions (mm) / Land Pattern Example (mm) |
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| MagazineDimensions (mm) |
 Thickness: 0.5 mm |
 A: Magazine, B: Stopper |
