常用集成电路的封装方式

常用集成电路的封装方式

CLCC

DIP
Dual Inline Package

DIP-tab
Dual Inline Package with Metal Heatsink

FBGA

FDIP

FTO220

Flat Pack

HSOP28

ITO220

ITO3p

JLCC

LCC

LDCC

LGA

LQFP

PCDIP

PLCC

PQFP

PSDIP

LQFP 100L

METAL QUAD 100L

PQFP 100L

QFP
Quad Flat Package

SOT143

SOT220

SOT223

SOT223

SOT23

SOT23/SOT323

SOT25/SOT353

SOT26/SOT363

SOT343

SOT523

SOT89

SOT89

LAMINATE TCSP 20L
Chip Scale Package

TO252

TO263/TO268

SO DIMM
Small Outline Dual In-line Memory Module

QFP
Quad Flat Package

TQFP 100L

SBGA

SC-70 5L

SDIP

SIP
Single Inline Package

SO
Small Outline Package

SOJ 32L

SOJ

SOP EIAJ TYPE II 14L

SOT220

SSOP 16L

SSOP

TO18

TO220

TO247

TO264

TO3

TO5

TO52

TO71

TO72

TO78

TO8

TO92

TO93

TO99

TSOP
Thin Small Outline Package

TSSOP or TSOP II
Thin Shrink Outline Package

uBGA
Micro Ball Grid Array

ZIP
Zig-Zag Inline Package

BQFP132

TEPBGA 288L

TEPBGA 288L

C-Bend Lead

CERQUAD
Ceramic Quad Flat Pack
　

Ceramic Case

Gull Wing Leads

J-STD

J-STD
Joint IPC / JEDEC Standards

JEP

JEP
JEDEC PublicaTIons

JESD

JESD
JEDEC Standards

LLP 8La

PCMCIA

PDIP

PLCC

PS/2

PS/2
mouse port pinout
　

SIMM30

SIMM30
Pinout
　

SIMM72

SIMM72
Pinout
　

SNAPTK

SNAPTK

SNAPZP

SOH